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LTC2290 Dual 12-Bit, 10Msps Low Power 3V ADC
FEATURES

DESCRIPTIO
Integrated Dual 12-Bit ADCs Sample Rate: 10Msps Single 3V Supply (2.7V to 3.4V) Low Power: 120mW 71.3dB SNR 90dB SFDR 110dB Channel Isolation Multiplexed or Separate Data Bus Flexible Input: 1VP-P to 2VP-P Range 575MHz Full Power Bandwidth S/H Clock Duty Cycle Stabilizer Shutdown and Nap Modes Pin Compatible Family 105Msps: LTC2282 (12-Bit), LTC2284 (14-Bit) 80Msps: LTC2294 (12-Bit), LTC2299 (14-Bit) 65Msps: LTC2293 (12-Bit), LTC2298 (14-Bit) 40Msps: LTC2292 (12-Bit), LTC2297 (14-Bit) 25Msps: LTC2291 (12-Bit), LTC2296 (14-Bit) 10Msps: LTC2290 (12-Bit), LTC2295 (14-Bit) 64-Pin (9mm x 9mm) QFN Package
The LTC(R)2290 is a 12-bit 10Msps, low power dual 3V A/D converter designed for digitizing high frequency, wide dynamic range signals. The LTC2290 is perfect for demanding imaging and communications applications with AC performance that includes 71.3dB SNR and 90dB SFDR for signals well beyond the Nyquist frequency. DC specs include 0.3LSB INL (typ), 0.15LSB DNL (typ) and no missing codes over temperature. The transition noise is a low 0.25LSBRMS. A single 3V supply allows low power operation. A separate output supply allows the outputs to drive 0.5V to 3.6V logic. An optional multiplexer allows both channels to share a digital output bus. A single-ended CLK input controls converter operation. An optional clock duty cycle stabilizer allows high performance at full speed for a wide range of clock duty cycles.
, LTC and LT are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners.
APPLICATIO S

Wireless and Wired Broadband Communication Imaging Systems Spectral Analysis Portable Instrumentation
TYPICAL APPLICATIO
+
ANALOG INPUT A INPUT S/H 12-BIT PIPELINED ADC CORE
OVDD OUTPUT DRIVERS D11A
* * *
1.0 0.8 0.6
-
D0A OGND
INL ERROR (LSB)
0.4 0.2 0 -0.2 -0.4 -0.6 -0.8
CLK A
CLOCK/DUTY CYCLE CONTROL MUX CLOCK/DUTY CYCLE CONTROL OVDD
CLK B
-1.0 0 1024 2048 CODE 3072 4096
2290 TA01
+
ANALOG INPUT B INPUT S/H
-
12-BIT PIPELINED ADC CORE
OUTPUT DRIVERS
D11B
* * *
D0B OGND
2295 TA01
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Typical INL, 2V Range
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LTC2290
ABSOLUTE AXI U RATI GS
PACKAGE/ORDER I FOR ATIO
TOP VIEW
64 GND 63 VDD 62 SENSEA 61 VCMA 60 MODE 59 SHDNA 58 OEA 57 OFA 56 DA11 55 DA10 54 DA9 53 DA8 52 DA7 51 DA6 50 OGND 49 OVDD
OVDD = VDD (Notes 1, 2)
Supply Voltage (VDD) ................................................. 4V Digital Output Ground Voltage (OGND) ....... -0.3V to 1V Analog Input Voltage (Note 3) ..... -0.3V to (VDD + 0.3V) Digital Input Voltage .................... -0.3V to (VDD + 0.3V) Digital Output Voltage ................ -0.3V to (OVDD + 0.3V) Power Dissipation ............................................ 1500mW Operating Temperature Range LTC2290C ............................................... 0C to 70C LTC2290I .............................................-40C to 85C Storage Temperature Range ..................-65C to 125C
AINA+ 1 AINA- 2 REFHA 3 REFHA 4 REFLA 5 REFLA 6 VDD 7 CLKA 8 CLKB 9 VDD 10 REFLB 11 REFLB 12 REFHB 13 REFHB 14 AINB- 15 AINB+ 16
65
48 DA5 47 DA4 46 DA3 45 DA2 44 DA1 43 DA0 42 NC 41 NC 40 OFB 39 DB11 38 DB10 37 DB9 36 DB8 35 DB7 34 DB6 33 DB5
UP PACKAGE 64-LEAD (9mm x 9mm) PLASTIC QFN TJMAX = 125C, JA = 20C/W EXPOSED PAD (PIN 65) IS GND AND MUST BE SOLDERED TO PCB
ORDER PART NUMBER LTC2290CUP LTC2290IUP
Order Options Tape and Reel: Add #TR Lead Free: Add #PBF Lead Free Tape and Reel: Add #TRPBF Lead Free Part Marking: http://www.linear.com/leadfree/ Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.
CO VERTER CHARACTERISTICS
PARAMETER Resolution (No Missing Codes) Integral Linearity Error Differential Linearity Error Offset Error Gain Error Offset Drift Full-Scale Drift Gain Matching Offset Matching Transition Noise CONDITIONS
The denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. (Note 4)
MIN

GND 17 VDD 18 SENSEB 19 VCMB 20 MUX 21 SHDNB 22 OEB 23 NC 24 NC 25 DB0 26 DB1 27 DB2 28 DB3 29 DB4 30 OGND 31 OVDD 32
QFN PART* MARKING LTC2290UP
TYP 0.3 0.15 2 0.5 10 30 5 0.3 2 0.25
MAX 1.3 0.7 12 2.5
UNITS Bits LSB LSB mV %FS V/C ppm/C ppm/C %FS mV LSBRMS
2290fa
Differential Analog Input (Note 5) Differential Analog Input (Note 6) External Reference Internal Reference External Reference External Reference SENSE = 1V
12 -1.3 -0.7 -12 -2.5
2
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LTC2290
A ALOG I PUT
SYMBOL VIN VIN,CM IIN ISENSE IMODE tAP tJITTER CMRR PARAMETER
The denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. (Note 4)
CONDITIONS 2.7V < VDD < 3.4V (Note 7) +AIN
-)/2
Analog Input Range (AIN+ -AIN-) Analog Input Common Mode (AIN+ Analog Input Leakage Current SENSEA, SENSEB Input Leakage MODE Input Leakage Current Sample-and-Hold Acquisition Delay Time Sample-and-Hold Acquisition Delay Time Jitter Analog Input Common Mode Rejection Ratio Full Power Bandwidth
DY A IC ACCURACY
SYMBOL SNR SFDR SFDR S/(N+D) IMD PARAMETER Signal-to-Noise Ratio
The denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. AIN = -1dBFS. (Note 4)
CONDITIONS 5MHz Input 70MHz Input Spurious Free Dynamic Range 2nd or 3rd Harmonic Spurious Free Dynamic Range 4th Harmonic or Higher Signal-to-Noise Plus Distortion Ratio Intermodulation Distortion Crosstalk 5MHz Input 70MHz Input 5MHz Input 70MHz Input 5MHz Input 70MHz Input fIN = 4.3MHz, 4.6MHz fIN = 5MHz

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MIN

TYP 0.5 to 1 1.5 1.5
MAX 1.9 2 1 3 3
UNITS V V V A A A ns psRMS dB MHz
Differential Input (Note 7) Single Ended Input (Note 7) 0V < AIN+, AIN- < VDD 0V < SENSEA, SENSEB < 1V 0V < MODE < VDD
1 0.5 -1 -3 -3
0 0.2 80 Figure 8 Test Circuit 575
MIN 69.6 74 80 69
TYP 71.3 70.7 90 85 90 90 71.3 70.4 90 -110
MAX
UNITS dB dB dB dB dB dB dB dB dB dB
2290fa
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LTC2290
I TER AL REFERE CE CHARACTERISTICS
PARAMETER VCM Output Voltage VCM Output Tempco VCM Line Regulation VCM Output Resistance CONDITIONS IOUT = 0
DIGITAL I PUTS A D DIGITAL OUTPUTS
SYMBOL VIH VIL IIN CIN LOGIC OUTPUTS OVDD = 3V COZ ISOURCE ISINK VOH VOL OVDD = 2.5V VOH VOL OVDD = 1.8V VOH VOL High Level Output Voltage Low Level Output Voltage IO = -200A IO = 1.6mA High Level Output Voltage Low Level Output Voltage IO = -200A IO = 1.6mA Hi-Z Output Capacitance Output Source Current Output Sink Current High Level Output Voltage Low Level Output Voltage PARAMETER High Level Input Voltage Low Level Input Voltage Input Current Input Capacitance CONDITIONS VDD = 3V VDD = 3V LOGIC INPUTS (CLK, OE, SHDN, MUX)
The denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. (Note 4)
MIN

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(Note 4)
MIN 1.475 TYP 1.500 25 3 4 MAX 1.525 UNITS V ppm/C mV/V
2.7V < VDD < 3.3V -1mA < IOUT < 1mA
TYP
MAX
UNITS V
2 0.8 -10 3 10
V A pF
VIN = 0V to VDD (Note 7)
OE = High (Note 7) VOUT = 0V VOUT = 3V IO = -10A IO = -200A IO = 10A IO = 1.6mA

3 50 50 2.7 2.995 2.99 0.005 0.09 2.49 0.09 1.79 0.09 0.4
pF mA mA V V V V V V V V
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LTC2290
POWER REQUIRE E TS
SYMBOL VDD OVDD IVDD PDISS PSHDN PNAP PARAMETER Analog Supply Voltage Output Supply Voltage Supply Current Power Dissipation Shutdown Power (Each Channel) Nap Mode Power (Each Channel)
The denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. (Note 8)
CONDITIONS (Note 9) (Note 9) Both ADCs at fS(MAX) Both ADCs at fS(MAX) SHDN = H, OE = H, No CLK SHDN = H, OE = L, No CLK

The denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25C. (Note 4)
SYMBOL fs tL tH tAP tD tMD PARAMETER Sampling Frequency CLK Low Time CLK High Time Sample-and-Hold Aperture Delay CLK to DATA Delay MUX to DATA Delay Data Access Time After OE BUS Relinquish Time Pipeline Latency Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: All voltage values are with respect to ground with GND and OGND wired together (unless otherwise noted). Note 3: When these pin voltages are taken below GND or above VDD, they will be clamped by internal diodes. This product can handle input currents of greater than 100mA below GND or above VDD without latchup. Note 4: VDD = 3V, fSAMPLE = 10MHz, input range = 2VP-P with differential drive, unless otherwise noted. CL = 5pF (Note 7) CL = 5pF (Note 7) CL = 5pF (Note 7) (Note 7)

TI I G CHARACTERISTICS
UW
MIN 2.7 0.5
TYP 3 3 40 120 2 15
MAX 3.4 3.6 46 138
UNITS V V mA mW mW mW
UW
CONDITIONS (Note 9) Duty Cycle Stabilizer Off Duty Cycle Stabilizer On (Note 7) Duty Cycle Stabilizer Off Duty Cycle Stabilizer On (Note 7)

MIN 1 40 5 40 5 1.4 1.4
TYP 50 50 50 50 0 2.7 2.7 4.3 3.3 5
MAX 10 500 500 500 500 5.4 5.4 10 8.5
UNITS MHz ns ns ns ns nS ns ns ns ns Cycles
Note 5: Integral nonlinearity is defined as the deviation of a code from a straight line passing through the actual endpoints of the transfer curve. The deviation is measured from the center of the quantization band. Note 6: Offset error is the offset voltage measured from -0.5 LSB when the output code flickers between 0000 0000 0000 and 1111 1111 1111. Note 7: Guaranteed by design, not subject to test. Note 8: VDD = 3V, fSAMPLE = 10MHz, input range = 1VP-P with differential drive. The supply current and power dissipation are the sum total for both channels with both channels active. Note 9: Recommended operating conditions.
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LTC2290 TYPICAL PERFOR A CE CHARACTERISTICS
Crosstalk vs Input Frequency
-100 -105 -110 -115 -120 -125 -130 0 20 40 60 80 INPUT FREQUENCY (MHz) 100
2290 G01
0.2 0 -0.2 -0.4 -0.6 -0.8 -1.0 0 1024 2048 CODE 3072 4096
2290 G02
DNL ERROR (LSB)
INL ERROR (LSB)
CROSSTALK (dB)
8192 Point FFT, fIN = 5.1MHz, -1dB, 2V Range
0 -10 -20 -30 0 -10 -20 -30
AMPLITUDE (dB)
AMPLITUDE (dB)
-50 -60 -70 -80 -90 -100 -110 -120
0
-50 -60 -70 -80 -90 -100 -110 -120
AMPLITUDE (dB)
-40
1
3 2 FREQUENCY (MHz)
Grounded Input Histogram
70000 61758 60000 50000
75 74 73 72 71 70 69 68 67
COUNT
40000 30000 20000 10000 2155 0 2048 2049 CODE 2050
2290 G07
SFDR (dBFS)
SNR (dBFS)
6
UW
4 1607
Typical INL, 2V Range
1.0 0.8 0.6 0.4 1.0 0.8 0.6 0.4 0.2 0 -0.2 -0.4 -0.6 -0.8 -1.0
Typical DNL, 2V Range
0
1024
2048 CODE
3072
4096
2290 G03
8192 Point FFT, fIN = 70.1MHz, -1dB, 2V Range
0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 0 1 3 2 FREQUENCY (MHz) 4 5
2290 G05
8192 Point 2-Tone FFT, fIN = 4.3MHz and 4.6MHz, -1dB, 2V Range
-40
5
2290 G04
-120
0
1
3 2 FREQUENCY (MHz)
4
5
2290 G06
SNR vs Input Frequency, -1dB, 2V Range
100 95 90 85 80 75 70 65
0 10 40 30 20 50 60 INPUT FREQUENCY (MHz) 70
SFDR vs Input Frequency, -1dB, 2V Range
66 65
0
10
40 60 30 50 20 INPUT FREQUENCY (MHz)
70
2290 G08
2290 G09
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LTC2290 TYPICAL PERFOR A CE CHARACTERISTICS
SNR and SFDR vs Sample Rate, 2V Range, fIN = 5MHz, -1dB
100
SNR AND SFDR (dBFS)
SFDR (dBc AND dBFS)
SNR (dBc AND dBFS)
90
80
70
60 0 2 10 12 4 6 8 SAMPLE RATE (Msps) 14
2290 G10
IVDD vs Sample Rate, 5MHz Sine Wave Input, -1dB
50
2V RANGE
40
1V RANGE
IOVDD (mA)
IVDD (mA)
30
20 0 2
10 4 6 8 SAMPLE RATE (Msps)
UW
SNR vs Input Level, fIN = 5MHz, 2V Range
80 dBFS 70 60 50 40 30 20 10 -0 -70 -60 -50 -40 -30 -20 INPUT LEVEL (dBFS) -10 0 dBc
120 110 100 90 80 70 60 50 40 30 20 10
SFDR vs Input Level, fIN = 5MHz, 2V Range
dBFS
dBc
90dBc SFDR REFERENCE LINE
0 -70
-60
-50 -40 -30 -20 INPUT LEVEL (dBFS)
-10
0
2290 G11
2290 G12
IOVDD vs Sample Rate, 5MHz Sine Wave Input, -1dB, OVDD = 1.8V
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2
12
14
0 0 2 8 6 4 10 SAMPLE RATE (Msps) 12 14
2290 G13
2290 G14
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LTC2290
PI FU CTIO S
AINA+ (Pin 1): Channel A Positive Differential Analog Input. AINA- (Pin 2): Channel A Negative Differential Analog Input. REFHA (Pins 3, 4): Channel A High Reference. Short together and bypass to Pins 5, 6 with a 0.1F ceramic chip capacitor as close to the pin as possible. Also bypass to Pins 5, 6 with an additional 2.2F ceramic chip capacitor and to ground with a 1F ceramic chip capacitor. REFLA (Pins 5, 6): Channel A Low Reference. Short together and bypass to Pins 3, 4 with a 0.1F ceramic chip capacitor as close to the pin as possible. Also bypass to Pins 3, 4 with an additional 2.2F ceramic chip capacitor and to ground with a 1F ceramic chip capacitor. VDD (Pins 7, 10, 18, 63): Analog 3V Supply. Bypass to GND with 0.1F ceramic chip capacitors. CLKA (Pin 8): Channel A Clock Input. The input sample starts on the positive edge. CLKB (Pin 9): Channel B Clock Input. The input sample starts on the positive edge. REFLB (Pins 11, 12): Channel B Low Reference. Short together and bypass to Pins 13, 14 with a 0.1F ceramic chip capacitor as close to the pin as possible. Also bypass to Pins 13, 14 with an additional 2.2F ceramic chip capacitor and to ground with a 1F ceramic chip capacitor. REFHB (Pins 13, 14): Channel B High Reference. Short together and bypass to Pins 11, 12 with a 0.1F ceramic chip capacitor as close to the pin as possible. Also bypass to Pins 11, 12 with an additional 2.2F ceramic chip capacitor and to ground with a 1F ceramic chip capacitor. AINB- (Pin 15): Channel B Negative Differential Analog Input. AINB+ (Pin 16): Channel B Positive Differential Analog Input. GND (Pins 17, 64): ADC Power Ground. SENSEB (Pin 19): Channel B Reference Programming Pin. Connecting SENSEB to VCMB selects the internal reference and a 0.5V input range. VDD selects the internal reference and a 1V input range. An external reference greater than 0.5V and less than 1V applied to SENSEB selects an input range of VSENSEB. 1V is the largest valid input range. VCMB (Pin 20): Channel B 1.5V Output and Input Common Mode Bias. Bypass to ground with 2.2F ceramic chip capacitor. Do not connect to VCMA. MUX (Pin 21): Digital Output Multiplexer Control. If MUX is High, Channel A comes out on DA0-DA11, OFA; Channel B comes out on DB0-DB11, OFB. If MUX is Low, the output busses are swapped and Channel A comes out on DB0DB11, OFB; Channel B comes out on DA0-DA11, OFA. To multiplex both channels onto a single output bus, connect MUX, CLKA and CLKB together. SHDNB (Pin 22): Channel B Shutdown Mode Selection Pin. Connecting SHDNB to GND and OEB to GND results in normal operation with the outputs enabled. Connecting SHDNB to GND and OEB to VDD results in normal operation with the outputs at high impedance. Connecting SHDNB to VDD and OEB to GND results in nap mode with the outputs at high impedance. Connecting SHDNB to VDD and OEB to VDD results in sleep mode with the outputs at high impedance. OEB (Pin 23): Channel B Output Enable Pin. Refer to SHDNB pin function. NC (Pins 24, 25, 41, 42): Do Not Connect These Pins. DB0 - DB11 (Pins 26 to 30, 33 to 39): Channel B Digital Outputs. DB11 is the MSB. OGND (Pins 31, 50): Output Driver Ground. OVDD (Pins 32, 49): Positive Supply for the Output Drivers. Bypass to ground with 0.1F ceramic chip capacitor. OFB (Pin 40): Channel B Overflow/Underflow Output. High when an overflow or underflow has occurred. DA0 - DA11 (Pins 43 to 48, 51 to 56): Channel A Digital Outputs. DA11 is the MSB. OFA (Pin 57): Channel A Overflow/Underflow Output. High when an overflow or underflow has occurred. OEA (Pin 58): Channel A Output Enable Pin. Refer to SHDNA Pin Function.
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LTC2290
PI FU CTIO S
SHDNA (Pin 59): Channel A Shutdown Mode Selection Pin. Connecting SHDNA to GND and OEA to GND results in normal operation with the outputs enabled. Connecting SHDNA to GND and OEA to VDD results in normal operation with the outputs at high impedance. Connecting SHDNA to VDD and OEA to GND results in nap mode with the outputs at high impedance. Connecting SHDNA to VDD and OEA to VDD results in sleep mode with the outputs at high impedance. MODE (Pin 60): Output Format and Clock Duty Cycle Stabilizer Selection Pin. Note that MODE controls both channels. Connecting MODE to GND selects offset binary output format and turns the clock duty cycle stabilizer off. 1/3 VDD selects offset binary output format and turns the clock duty cycle stabilizer on. 2/3 VDD selects 2's complement output format and turns the clock duty cycle stabilizer on. VDD selects 2's complement output format and turns the clock duty cycle stabilizer off. VCMA (Pin 61): Channel A 1.5V Output and Input Common Mode Bias. Bypass to ground with 2.2F ceramic chip capacitor. Do not connect to VCMB. SENSEA (Pin 62): Channel A Reference Programming Pin. Connecting SENSEA to VCMA selects the internal reference and a 0.5V input range. VDD selects the internal reference and a 1V input range. An external reference greater than 0.5V and less than 1V applied to SENSEA selects an input range of VSENSEA. 1V is the largest valid input range. GND (Exposed Pad) (Pin 65): ADC Power Ground. The Exposed Pad on the bottom of the package needs to be soldered to ground.
FUNCTIONAL BLOCK DIAGRA
AIN+ INPUT S/H FIRST PIPELINED ADC STAGE SECOND PIPELINED ADC STAGE AIN-
VCM 2.2F
1.5V REFERENCE
RANGE SELECT
REFH SENSE REF BUF
DIFF REF AMP
REFH
0.1F
2.2F 1F 1F
Figure 1. Functional Block Diagram (Only One Channel is Shown)
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THIRD PIPELINED ADC STAGE
FOURTH PIPELINED ADC STAGE
FIFTH PIPELINED ADC STAGE
SIXTH PIPELINED ADC STAGE
SHIFT REGISTER AND CORRECTION
REFL
INTERNAL CLOCK SIGNALS OVDD OF CLOCK/DUTY CYCLE CONTROL D11 CONTROL LOGIC OUTPUT DRIVERS * * * D0
REFL CLK MODE SHDN OE
2290 F01
OGND
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LTC2290
TI I G DIAGRA S
Dual Digital Output Bus Timing (Only One Channel is Shown)
tAP ANALOG INPUT N N+1 tH CLK tD D0-D11, OF N-5 N-4 N-3 N-2 N-1 N
2290 TD01
ANALOG INPUT A
ANALOG INPUT B
CLKA = CLKB = MUX
D0A-D11A, OFA
D0B-D11B, OFB
10
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N+2 N+3
N+4 N+5
tL
Multiplexed Digital Output Bus Timing
tAPA A A+1 tAPB B B+1 tH tL B+2 B+3 B+4 A+2 A+3 A+4
A-5 tD B-5
B-5
A-4
B-4 t MD
A-3
B-3
A-2
B-2
A-1
A-5
B-4
A-4
B-3
A-3
B-2
A-2
B-1
2290 TD02
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LTC2290
APPLICATIO S I FOR ATIO
DYNAMIC PERFORMANCE Signal-to-Noise Plus Distortion Ratio The signal-to-noise plus distortion ratio [S/(N + D)] is the ratio between the RMS amplitude of the fundamental input frequency and the RMS amplitude of all other frequency components at the ADC output. The output is band limited to frequencies above DC to below half the sampling frequency. Signal-to-Noise Ratio The signal-to-noise ratio (SNR) is the ratio between the RMS amplitude of the fundamental input frequency and the RMS amplitude of all other frequency components except the first five harmonics and DC. Total Harmonic Distortion Total harmonic distortion is the ratio of the RMS sum of all harmonics of the input signal to the fundamental itself. The out-of-band harmonics alias into the frequency band between DC and half the sampling frequency. THD is expressed as: THD = 20Log ((V22 + V32 + V42 + . . . Vn2)/V1) where V1 is the RMS amplitude of the fundamental frequency and V2 through Vn are the amplitudes of the second through nth harmonics. The THD calculated in this data sheet uses all the harmonics up to the fifth. Intermodulation Distortion If the ADC input signal consists of more than one spectral component, the ADC transfer function nonlinearity can produce intermodulation distortion (IMD) in addition to THD. IMD is the change in one sinusoidal input caused by the presence of another sinusoidal input at a different frequency. If two pure sine waves of frequencies fa and fb are applied to the ADC input, nonlinearities in the ADC transfer function can create distortion products at the sum and difference frequencies of mfa nfb, where m and n = 0, 1, 2, 3, etc. The 3rd order intermodulation products are 2fa + fb, Aperture Delay Time The time from when CLK reaches midsupply to the instant that the input signal is held by the sample and hold circuit. Aperture Delay Jitter The variation in the aperture delay time from conversion to conversion. This random variation will result in noise when sampling an AC input. The signal to noise ratio due to the jitter alone will be: SNRJITTER = -20log (2 * fIN * tJITTER) Crosstalk Crosstalk is the coupling from one channel (being driven by a full-scale signal) onto the other channel (being driven by a -1dBFS signal). CONVERTER OPERATION As shown in Figure 1, the LTC2290 is a dual CMOS pipelined multistep converter. The converter has six pipelined ADC stages; a sampled analog input will result in a digitized value five cycles later (see the Timing Diagram section). For optimal AC performance the analog inputs should be driven differentially. For cost sensitive
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2fb + fa, 2fa - fb and 2fb - fa. The intermodulation distortion is defined as the ratio of the RMS value of either input tone to the RMS value of the largest 3rd order intermodulation product. Spurious Free Dynamic Range (SFDR) Spurious free dynamic range is the peak harmonic or spurious noise that is the largest spectral component excluding the input signal and DC. This value is expressed in decibels relative to the RMS value of a full scale input signal. Input Bandwidth The input bandwidth is that input frequency at which the amplitude of the reconstructed fundamental is reduced by 3dB for a full scale input signal.
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LTC2290
APPLICATIO S I FOR ATIO
applications, the analog inputs can be driven single-ended with slightly worse harmonic distortion. The CLK input is single-ended. The LTC2290 has two phases of operation, determined by the state of the CLK input pin. Each pipelined stage shown in Figure 1 contains an ADC, a reconstruction DAC and an interstage residue amplifier. In operation, the ADC quantizes the input to the stage and the quantized value is subtracted from the input by the DAC to produce a residue. The residue is amplified and output by the residue amplifier. Successive stages operate out of phase so that when the odd stages are outputting their residue, the even stages are acquiring that residue and vice versa. When CLK is low, the analog input is sampled differentially directly onto the input sample-and-hold capacitors, inside the "Input S/H" shown in the block diagram. At the instant that CLK transitions from low to high, the sampled input is held. While CLK is high, the held input voltage is buffered by the S/H amplifier which drives the first pipelined ADC stage. The first stage acquires the output of the S/H during this high phase of CLK. When CLK goes back low, the first stage produces its residue which is acquired by the second stage. At the same time, the input S/H goes back to acquiring the analog input. When CLK goes back high, the second stage produces its residue which is acquired by the third stage. An identical process is repeated for the
LTC2290 VDD 15 CPARASITIC 1pF CSAMPLE 4pF CPARASITIC 1pF VDD CLK CSAMPLE 4pF
AIN+
VDD 15
AIN-
Figure 2. Equivalent Input Circuit
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third, fourth and fifth stages, resulting in a fifth stage residue that is sent to the sixth stage ADC for final evaluation. Each ADC stage following the first has additional range to accommodate flash and amplifier offset errors. Results from all of the ADC stages are digitally synchronized such that the results can be properly combined in the correction logic before being sent to the output buffer. SAMPLE/HOLD OPERATION AND INPUT DRIVE Sample/Hold Operation Figure 2 shows an equivalent circuit for the LTC2290 CMOS differential sample-and-hold. The analog inputs are connected to the sampling capacitors (CSAMPLE) through NMOS transistors. The capacitors shown attached to each input (CPARASITIC) are the summation of all other capacitance associated with each input. During the sample phase when CLK is low, the transistors connect the analog inputs to the sampling capacitors and they charge to and track the differential input voltage. When CLK transitions from low to high, the sampled input voltage is held on the sampling capacitors. During the hold phase when CLK is high, the sampling capacitors are disconnected from the input and the held voltage is passed to the ADC core for processing. As CLK transitions from
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LTC2290
APPLICATIO S I FOR ATIO
high to low, the inputs are reconnected to the sampling capacitors to acquire a new sample. Since the sampling capacitors still hold the previous sample, a charging glitch proportional to the change in voltage between samples will be seen at this time. If the change between the last sample and the new sample is small, the charging glitch seen at the input will be small. If the input change is large, such as the change seen with input frequencies near Nyquist, then a larger charging glitch will be seen. Single-Ended Input For cost sensitive applications, the analog inputs can be driven single-ended. With a single-ended input the harmonic distortion and INL will degrade, but the SNR and DNL will remain unchanged. For a single-ended input, AIN+ should be driven with the input signal and AIN- should be connected to VCM or a quiet reference voltage between 0.5V and 1.5V. Common Mode Bias For optimal performance the analog inputs should be driven differentially. Each input should swing 0.5V for the 2V range or 0.25V for the 1V range, around a common mode voltage of 1.5V. The VCM output pin may be used to provide the common mode bias level. VCM can be tied directly to the center tap of a transformer to set the DC input level or as a reference level to an op amp differential driver circuit. The VCM pin must be bypassed to ground close to the ADC with a 2.2F or greater capacitor. Input Drive Impedance As with all high performance, high speed ADCs, the dynamic performance of the LTC2290 can be influenced by the input drive circuitry, particularly the second and third harmonics. Source impedance and reactance can influence SFDR. At the falling edge of CLK, the sampleand-hold circuit will connect the 4pF sampling capacitor to the input pin and start the sampling period. The sampling period ends when CLK rises, holding the sampled input on
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the sampling capacitor. Ideally the input circuitry should be fast enough to fully charge the sampling capacitor during the sampling period 1/(2FENCODE); however, this is not always possible and the incomplete settling may degrade the SFDR. The sampling glitch has been designed to be as linear as possible to minimize the effects of incomplete settling. For the best performance, it is recommended to have a source impedance of 100 or less for each input. The source impedance should be matched for the differential inputs. Poor matching will result in higher even order harmonics, especially the second. Input Drive Circuits Figure 3 shows the LTC2290 being driven by an RF transformer with a center tapped secondary. The secondary center tap is DC biased with VCM, setting the ADC input signal at its optimum DC level. Terminating on the transformer secondary is desirable, as this provides a common mode path for charging glitches caused by the sample and hold. Figure 3 shows a 1:1 turns ratio transformer. Other turns ratios can be used if the source impedance seen by the ADC does not exceed 100 for each ADC input. A disadvantage of using a transformer is the loss of low frequency response. Most small RF transformers have poor performance at frequencies below 1MHz.
VCM 2.2F 0.1F ANALOG INPUT T1 1:1 25 25 T1 = MA/COM ETC1-1T 25 RESISTORS, CAPACITORS ARE 0402 PACKAGE SIZE 25 0.1F 12pF AIN-
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AIN+
LTC2290
Figure 3. Single-Ended to Differential Conversion Using a Transformer
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LTC2290
APPLICATIO S I FOR ATIO
Figure 4 demonstrates the use of a differential amplifier to convert a single ended input signal into a differential input signal. The advantage of this method is that it provides low frequency input response; however, the limited gain bandwidth of most op amps will limit the SFDR at high input frequencies.
VCM HIGH SPEED DIFFERENTIAL 25 AMPLIFIER ANALOG INPUT 2.2F AIN+ LTC2290
+
CM
+
12pF
-
-
25
AIN-
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Figure 4. Differential Drive with an Amplifier
Figure 5 shows a single-ended input circuit. The impedance seen by the analog inputs should be matched. This circuit is not recommended if low distortion is required.
VCM 1k 0.1F ANALOG INPUT 1k 25 2.2F AIN+ LTC2290
12pF 25 0.1F AIN-
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Figure 5. Single-Ended Drive
1F
The 25 resistors and 12pF capacitor on the analog inputs serve two purposes: isolating the drive circuitry from the sample-and-hold charging glitches and limiting the wideband noise at the converter input.
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Reference Operation Figure 6 shows the LTC2290 reference circuitry consisting of a 1.5V bandgap reference, a difference amplifier and switching and control circuit. The internal voltage reference can be configured for two pin selectable input ranges of 2V (1V differential) or 1V (0.5V differential). Tying the SENSE pin to VDD selects the 2V range; tying the SENSE pin to VCM selects the 1V range. The 1.5V bandgap reference serves two functions: its output provides a DC bias point for setting the common mode voltage of any external input circuitry; additionally, the reference is used with a difference amplifier to generate the differential reference levels needed by the internal ADC circuitry. An external bypass capacitor is required for the 1.5V reference output, VCM. This provides a high frequency low impedance path to ground for internal and external circuitry.
LTC2290 1.5V VCM 2.2F 1V RANGE DETECT AND CONTROL SENSE BUFFER INTERNAL ADC HIGH REFERENCE REFH 0.5V 4 1.5V BANDGAP REFERENCE TIE TO VDD FOR 2V RANGE; TIE TO VCM FOR 1V RANGE; RANGE = 2 * VSENSE FOR 0.5V < VSENSE < 1V 1F 2.2F 0.1F DIFF AMP REFL INTERNAL ADC LOW REFERENCE
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Figure 6. Equivalent Reference Circuit
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LTC2290
APPLICATIO S I FOR ATIO
The difference amplifier generates the high and low reference for the ADC. High speed switching circuits are connected to these outputs and they must be externally bypassed. Each output has two pins. The multiple output pins are needed to reduce package inductance. Bypass capacitors must be connected as shown in Figure 6. Each ADC channel has an independent reference with its own bypass capacitors. The two channels can be used with the same or different input ranges. Other voltage ranges between the pin selectable ranges can be programmed with two external resistors as shown in Figure 7. An external reference can be used by applying its output directly or through a resistor divider to SENSE. It is not recommended to drive the SENSE pin with a logic device. The SENSE pin should be tied to the appropriate level as close to the converter as possible. If the SENSE pin is driven externally, it should be bypassed to ground as close to the device as possible with a 1F ceramic capacitor. For the best channel matching, connect an external reference to SENSEA and SENSEB.
1.5V VCM 2.2F 12k 0.75V SENSE
LTC2290
12k
1F
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Figure 7. 1.5V Range ADC
Input Range The input range can be set based on the application. The 2V input range will provide the best signal-to-noise performance while maintaining excellent SFDR. The 1V input range will have better SFDR performance, but the SNR will degrade by 3.8dB.
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Driving the Clock Input The CLK inputs can be driven directly with a CMOS or TTL level signal. A differential clock can also be used along with a low jitter CMOS converter before the CLK pin (Figure 8).
CLEAN SUPPLY FERRITE BEAD 0.1F 4.7F CLK 100 LTC2290
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IF LVDS USE FIN1002 OR FIN1018. FOR PECL, USE AZ1000ELT21 OR SIMILAR
Figure 8. CLK Drive Using an LVDS or PECL to CMOS Converter
The noise performance of the LTC2290 can depend on the clock signal quality as much as on the analog input. Any noise present on the clock signal will result in additional aperture jitter that will be RMS summed with the inherent ADC aperture jitter. It is recommended that CLKA and CLKB are shorted together and driven by the same clock source. If a small time delay is desired between when the two channels sample the analog inputs, CLKA and CLKB can be driven by two different signals. If this delay exceeds 1ns, the performance of the part may degrade. CLKA and CLKB should not be driven by asynchronous signals.
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LTC2290
APPLICATIO S I FOR ATIO
Maximum and Minimum Conversion Rates
The maximum conversion rate for the LTC2290 is 10Msps. For the ADC to operate properly, the CLK signal should have a 50% (10%) duty cycle. Each half cycle must have at least 40ns for the ADC internal circuitry to have enough settling time for proper operation. An optional clock duty cycle stabilizer circuit can be used if the input clock has a non 50% duty cycle. This circuit uses the rising edge of the CLK pin to sample the analog input. The falling edge of CLK is ignored and the internal falling edge is generated by a phase-locked loop. The input clock duty cycle can vary and the clock duty cycle stabilizer will maintain a constant 50% internal duty cycle. If the clock is turned off for a long period of time, the duty cycle stabilizer circuit will require a hundred clock cycles for the PLL to lock onto the input clock. To use the clock duty cycle stabilizer, the MODE pin should be connected to 1/3VDD or 2/3VDD using external resistors. The MODE pin controls both Channel A and Channel B--the duty cycle stabilizer is either on or off for both channels. The lower limit of the LTC2290 sample rate is determined by droop of the sample-and-hold circuits. The pipelined architecture of this ADC relies on storing analog signals on small valued capacitors. Junction leakage will discharge the capacitors. The specified minimum operating frequency for the LTC2290 is 1Msps. DIGITAL OUTPUTS
Table 1. Output Codes vs Input Voltage
AIN+ - AIN- (2V Range) >+1.000000V +0.999512V +0.999024V +0.000488V 0.000000V -0.000488V -0.000976V -0.999512V -1.000000V <-1.000000V OF 1 0 0 0 0 0 0 0 0 1 D11 - D0 (Offset Binary) 1111 1111 1111 1111 1111 1111 1111 1111 1110 1000 0000 0001 1000 0000 0000 0111 1111 1111 0111 1111 1110 0000 0000 0001 0000 0000 0000 0000 0000 0000 D11 - D0 (2's Complement) 0111 1111 1111 0111 1111 1111 0111 1111 1110 0000 0000 0001 0000 0000 0000 1111 1111 1111 1111 1111 1110 1000 0000 0001 1000 0000 0000 1000 0000 0000
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Digital Output Buffers Figure 9 shows an equivalent circuit for a single output buffer. Each buffer is powered by OVDD and OGND, isolated from the ADC power and ground. The additional N-channel transistor in the output driver allows operation down to low voltages. The internal resistor in series with the output makes the output appear as 50 to external circuitry and may eliminate the need for external damping resistors.
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OVDD
VDD
VDD
0.5V TO 3.6V
0.1F
OVDD
DATA FROM LATCH
OE
PREDRIVER LOGIC
43
TYPICAL DATA OUTPUT OGND
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Figure 9. Digital Output Buffer
As with all high speed/high resolution converters, the digital output loading can affect the performance. The digital outputs of the LTC2290 should drive a minimal capacitive load to avoid possible interaction between the digital outputs and sensitive input circuitry. The output should be buffered with a device such as an ALVCH16373 CMOS latch. For full speed operation the capacitive load should be kept under 10pF. Lower OVDD voltages will also help reduce interference from the digital outputs.
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LTC2290
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Data Format
Using the MODE pin, the LTC2290 parallel digital output can be selected for offset binary or 2's complement format. Note that MODE controls both Channel A and Channel B. Connecting MODE to GND or 1/3VDD selects offset binary output format. Connecting MODE to 2/3VDD or VDD selects 2's complement output format. An external resistor divider can be used to set the 1/3VDD or 2/3VDD logic values. Table 2 shows the logic states for the MODE pin.
Table 2. MODE Pin Function
MODE Pin 0 1/3VDD 2/3VDD VDD Output Format Offset Binary Offset Binary 2's Complement 2's Complement Clock Duty Cycle Stabilizer Off On On Off
Overflow Bit When OF outputs a logic high the converter is either overranged or underranged. Output Driver Power Separate output power and ground pins allow the output drivers to be isolated from the analog circuitry. The power supply for the digital output buffers, OVDD, should be tied to the same power supply as for the logic being driven. For example, if the converter is driving a DSP powered by a 1.8V supply, then OVDD should be tied to that same 1.8V supply.
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OVDD can be powered with any voltage from 500mV up to 3.6V. OGND can be powered with any voltage from GND up to 1V and must be less than OVDD. The logic outputs will swing between OGND and OVDD. Output Enable The outputs may be disabled with the output enable pin, OE. OE high disables all data outputs including OF. Channels A and B have independent output enable pins (OEA, OEB). Sleep and Nap Modes The converter may be placed in shutdown or nap modes to conserve power. Connecting SHDN to GND results in normal operation. Connecting SHDN to VDD and OE to VDD results in sleep mode, which powers down all circuitry including the reference and typically dissipates 1mW. When exiting sleep mode it will take milliseconds for the output data to become valid because the reference capacitors have to recharge and stabilize. Connecting SHDN to VDD and OE to GND results in nap mode, which typically dissipates 30mW. In nap mode, the on-chip reference circuit is kept on, so that recovery from nap mode is faster than that from sleep mode, typically taking 100 clock cycles. In both sleep and nap modes, all digital outputs are disabled and enter the Hi-Z state. Channels A and B have independent SHDN pins (SHDNA, SHDNB). Channel A is controlled by SHDNA and OEA, and Channel B is controlled by SHDNB and OEB. The nap, sleep and output enable modes of the two channels are completely independent, so it is possible to have one channel operating while the other channel is in nap or sleep mode.
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LTC2290
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Digital Output Multiplexer
The digital outputs of the LTC2290 can be multiplexed onto a single data bus. The MUX pin is a digital input that swaps the two data busses. If MUX is High, Channel A comes out on DA0-DA11, OFA; Channel B comes out on DB0-DB11, OFB. If MUX is Low, the output busses are swapped and Channel A comes out on DB0-DB11, OFB; Channel B comes out on DA0-DA11, OFA. To multiplex both channels onto a single output bus, connect MUX, CLKA and CLKB together (see the Timing Diagram for the multiplexed mode). The multiplexed data is available on either data bus--the unused data bus can be disabled with its OE pin. Grounding and Bypassing The LTC2290 requires a printed circuit board with a clean, unbroken ground plane. A multilayer board with an internal ground plane is recommended. Layout for the printed circuit board should ensure that digital and analog signal lines are separated as much as possible. In particular, care should be taken not to run any digital track alongside an analog signal track or underneath the ADC.
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High quality ceramic bypass capacitors should be used at the VDD, OVDD, VCM, REFH, and REFL pins. Bypass capacitors must be located as close to the pins as possible. Of particular importance is the 0.1F capacitor between REFH and REFL. This capacitor should be placed as close to the device as possible (1.5mm or less). A size 0402 ceramic capacitor is recommended. The large 2.2F capacitor between REFH and REFL can be somewhat further away. The traces connecting the pins and bypass capacitors must be kept short and should be made as wide as possible. The LTC2290 differential inputs should run parallel and close to each other. The input traces should be as short as possible to minimize capacitance and to minimize noise pickup. Heat Transfer Most of the heat generated by the LTC2290 is transferred from the die through the bottom-side exposed pad and package leads onto the printed circuit board. For good electrical and thermal performance, the exposed pad should be soldered to a large grounded pad on the PC board. It is critical that all ground pins are connected to a ground plane of sufficient area.
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VCC JP1 MODE VDD 1 2 4 6 8 C1 0.1F C2 2.2F R1 1k 3 5 7 GND 1/3VDD 2/3VDD R2 1k R3 1k C44 0.1F 74VCX245BQX VDD
JP2 SENSE A
VDD
3
VCM
4
E1 EXT REF A
EXT REF 5 6
20 VCC 18 2 A0 B0 17 3 A1 B1 16 4 B2 A2 15 5 A3 B3 14 6 B4 A4 13 7 A5 B5 12 8 A6 B6 11 9 A7 B7 1 T/R 19 10 OE GND
J2 ANALOG R4 INPUT A OPT VDD
64 63 62 61 60 59 58 57 56 55 54 53 52 51 50 49
C3 T1 0.1F ETC1-1T 5 1 VCC C6 12pF C4 0.1F VCC C5 0.1F
R5 24.9
2
R6 24.9
34 32 30 28 26 24 22 20 RN3A 33 RN4D 33 RN4C 33 RN4B 33 18 16 14 12 10 C16 0.1F 8 6 RN3D 33 RN3C 33 RN3B 33
APPLICATIO S I FOR ATIO U
4 2 R28 24 C43 8.2pF
228876 AI01
4
GND VDD SENSEA VCMA MODE SHDNA OEA OFA DA11 DA10 DA9 DA8 DA7 DA6 OGND OVDD
*
*3
C7 0.1F C9 1F C10 2.2F C13 1F U1 LTC2290 C11 0.1F
R8 51
L1 BEAD
C12 4.7F 6.3V
VCMA
R9 24.9 C8 0.1F
VDD
VDD
C14 0.1F
R10 1k C18 1F C20 2.2F C21 0.1F C23 1F
GND VDD SENSEB VCMB MUX SHDNB OEB NC NC DB0 DB1 DB2 DB3 DB4 OGND OVDD
C15 0.1F
VDD
20 VCC 18 2 A0 B0 17 3 A1 B1 16 4 B2 A2 15 5 A3 B3 14 6 B4 A4 13 7 A5 B5 12 8 A6 B6 11 9 B7 A7 1 T/R 19 10 OE GND 74VCX245BQX VCC
J3 CLOCK INPUT
C19 0.1F
U3 NC7SVU04
C17 0.1F
3201S-40G1 39 40 39 37 38 37 35 35 36 33 34 33 31 31 32 29 30 29 27 27 28 25 25 26 23 23 24 21 21 22 19 19 20 17 17 18 15 15 16 13 13 14 11 11 12 9 9 10 7 7 8 5 5 6 3 4 3 1 1 2 RN1D 33 RN1C 33 RN1B 33 RN1A 33 RN2D 33 RN2C 33 RN2B 33 RN2A 33 R11 10k R12 10k C24 0.1F R13 10k
R14 49.9 VCC C25 0.1F VCC R27 TBD
R15 1k
C13 0.1F
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 AINA+ AINA- REFHA REFHA REFLA REFLA VDD CLKA CLKB VDD REFLB REFLB REFHB REFHB AINB- AINB+ DA5 DA4 DA3 DA2 DA1 DA0 NC NC OFB DB11 DB10 DB9 DB8 DB7 DB6 DB5 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33
R32 22
17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
U6 NC7SVU04 VDD C27 0.1F VCC R25 105k
R16 33 VDD R18 24.9 VCMB R20 24.9 JP3 SENSE C31 12pF VDD VCMB E2 EXT REF B C35 0.1F EXT REF 5 6 3 4 VCM C37 10F 6.3V R26 100k 1 2 VDD R22 24.9 C28 2.2F
VCC
U4 NC7SV86P5X
1 A0 2 A1 3 A2 4 A3
8 VCC 7 WP 6 SCL 5 SDA U5 24LC025 VDD R31 TBD U10 NC7SV86P5X E4 GND E3 VDD 3V VCC C26 0.1F
R30 15
J4 ANALOG R17 INPUT B OPT 2
C29 T2 0.1F ETC1-1T 4 1
VDD 8 7 6 5 C39 1F
C36 E5 4.7F PWR GND VCC
5
*
*3
C33 0.1F R24 24.9 C34 0.1F
R23 51
U8 LT1763 1 IN OUT 2 ADJ GND 3 GND GND 4 BYP SHDN C38 0.01F
U7 NC7SV86P5X
R29 51
L2 47nH C30 18pF C40 0.1F C41 0.1F
L3 47nH C32 18pF
L4 47nH C42 8.2pF
VCMB
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LTC2290
R7 24.9
W
VCMA
40 38 36
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1
VDD
2
19
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LTC2290
APPLICATIO S I FOR ATIO
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Silkscreen Top Top Side
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LTC2290
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Inner Layer 2 GND Inner Layer 3 Power
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LTC2290
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Bottom Side
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LTC2290
PACKAGE DESCRIPTIO
0.25 0.05 0.50 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS 9 .00 0.10 (4 SIDES) 0.75 0.05 R = 0.115 TYP
PIN 1 TOP MARK (SEE NOTE 5)
0.00 - 0.05 NOTE: 1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION WNJR-5 2. ALL DIMENSIONS ARE IN MILLIMETERS 3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT 4. EXPOSED PAD SHALL BE SOLDER PLATED 5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 6. DRAWING NOT TO SCALE
Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
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UP Package 64-Lead Plastic QFN (9mm x 9mm)
(Reference LTC DWG # 05-08-1705)
0.70 0.05 7.15 0.05 8.10 0.05 9.50 0.05 (4 SIDES) PACKAGE OUTLINE 63 64 0.40 0.10 1 2 PIN 1 CHAMFER 7.15 0.10 (4-SIDES) 0.200 REF 0.25 0.05 0.50 BSC BOTTOM VIEW--EXPOSED PAD
(UP64) QFN 1003
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LTC2290
RELATED PARTS
PART NUMBER LTC2220 LTC2221 LTC2222 LTC2223 LTC2224 LTC2225 LTC2226 LTC2227 LTC2228 LTC2230 LTC2231 LTC2232 LTC2233 LTC2245 LTC2246 LTC2247 LTC2248 LTC2249 LTC2291 LTC2292 LTC2293 LTC2295 LTC2296 LTC2297 LTC2298 DESCRIPTION 12-Bit, 170Msps ADC 12-Bit, 135Msps ADC 12-Bit, 105Msps ADC 12-Bit, 80Msps ADC 12-Bit, 135Msps ADC 12-Bit, 10Msps ADC 12-Bit, 25Msps ADC 12-Bit, 40Msps ADC 12-Bit, 65Msps ADC 10-Bit, 170Msps ADC 10-Bit, 135Msps ADC 10-Bit, 105Msps ADC 10-Bit, 80Msps ADC 14-Bit, 10Msps ADC 14-Bit, 25Msps ADC 14-Bit, 40Msps ADC 14-Bit, 65Msps ADC 14-Bit, 80Msps ADC 12-Bit, Dual, 25Msps ADC 12-Bit, Dual, 40Msps ADC 12-Bit, Dual, 65Msps ADC 14-Bit, Dual, 10Msps ADC 14-Bit, Dual, 25Msps ADC 14-Bit, Dual, 40Msps ADC 14-Bit, Dual, 65Msps ADC COMMENTS 890mW, 67.5dB SNR, 9mm x 9mm QFN Package 630mW, 67.5dB SNR, 9mm x 9mm QFN Package 475mW, 67.9dB SNR, 7mm x 7mm QFN Package 366mW, 68dB SNR, 7mm x 7mm QFN Package 630mW, 67.5dB SNR, 7mm x 7mm QFN Package 60mW, 71.4dB SNR, 5mm x 5mm QFN Package 75mW, 71.4dB SNR, 5mm x 5mm QFN Package 120mW, 71.4dB SNR, 5mm x 5mm QFN Package 205mW, 71.3dB SNR, 5mm x 5mm QFN Package 890mW, 67.5dB SNR, 9mm x 9mm QFN Package 630mW, 67.5dB SNR, 9mm x 9mm QFN Package 475mW, 61.3dB SNR, 7mm x 7mm QFN Package 366mW, 61.3dB SNR, 7mm x 7mm QFN Package 60mW, 74.4dB SNR, 5mm x 5mm QFN Package 75mW, 74.5dB SNR, 5mm x 5mm QFN Package 120mW, 74.4dB SNR, 5mm x 5mm QFN Package 205mW, 74.3dB SNR, 5mm x 5mm QFN Package 222mW, 73dB SNR, 5mm x 5mm QFN Package 150mW, 74.5dB SNR, 9mm x 9mm QFN Package 235mW, 74.4dB SNR, 9mm x 9mm QFN Package 400mW, 74.3dB SNR, 9mm x 9mm QFN Package 120mW, 74.4dB SNR, 9mm x 9mm QFN Package 150mW, 74.5dB SNR, 9mm x 9mm QFN Package 235mW, 74.4dB SNR, 9mm x 9mm QFN Package 400mW, 74.3dB SNR, 9mm x 9mm QFN Package
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Linear Technology Corporation
1630 McCarthy Blvd., Milpitas, CA 95035-7417
(408) 432-1900 FAX: (408) 434-0507
RD/LT 0106 REV A * PRINTED IN USA
www.linear.com
(c) LINEAR TECHNOLOGY CORPORATION 2004

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